Sigao Model B Fanless PC, 15th Gen 24-Core Ultra 9 285T, DDR5, Dual LAN, PCIe 5.0 SSD, up to 128GB [B860i]

Features

• Silent, fanless 24-core Intel® Core Ultra 9 Mini PC
• 15th Gen Intel hybrid architecture (Performance + Efficient cores, NPU)
• Supports up to 128GB high-speed DDR5 memory
• PCIe 5.0 or 4.0 SSD with custom heat pipe cooling
• Dual LAN connectivity: 2.5GbE + 1GbE
• Industrial-grade 7kg chassis made from aluminium and steel
• 500W audio-grade, silent internal DC power supply
• Includes 240W external AC power adapter
• Secondary PCIe 4.0 SSD slot, user-accessible
• Optional dual 2.5" SSD or HDD support
• Energy-efficient design with low power usage and minimal heat output

Description

This 15th Generation Fanless PC leverages Intel’s advanced hybrid architecture, combining high-performance and power-efficient cores to deliver exceptional speed and responsiveness for demanding personal or professional applications.

Powered by the Intel® Core Ultra 9 processor, this system introduces Intel® AI Boost—a dedicated Neural Processing Unit (NPU) designed to accelerate AI workloads. It also delivers over twice the 3D graphics performance of the previous 14th Generation, offering a significant boost for both visual and computational tasks.

To prevent thermal throttling during sustained workloads, we’ve engineered a custom heat pipe cooling solution for high-performance SSDs such as the PCIe 5.0 Samsung 9100 PRO or the PCIe 4.0 Samsung 990 PRO. A second PCIe 4.0 SSD slot is also available, conveniently accessible beneath the system’s baseplate for future upgrades.

The industrial-grade chassis, precision-manufactured in Germany, weighs 7 kg and is built from aluminium and steel. Integrated O-ring gaskets and silicone seals provide effective protection against dust and water spray, ensuring reliable operation in harsh environments.

This model includes the ASRock B860i motherboard, known for its stability and robust feature set: dual LAN (2.5GbE + 1GbE), Wi-Fi 6E, DisplayPort 1.4, HDMI 2.1, and USB 3.2 Gen 2x2 via USB-C.

Efficient, silent cooling is achieved using a copper CPU block connected to external cooling fins via heat pipes. The motherboard’s chipset also benefits from heat pipe cooling, eliminating the need for air vents. With no moving parts and no airflow through the chassis, the system offers dust-proof, maintenance-free reliability.

The internal 500W HDPlex power supply is audio-grade and completely silent—ideal for audiophile setups. A 240W 20V external AC adapter is included, supporting worldwide voltages. UK, EU, and US power cables are supplied based on your region.

Additional storage options include two 2.5" bays for SATA SSDs or hard drives.

A PCIe expansion slot (1x or 4x via flexible riser cable) allows for a variety of add-on cards. Several compatible options are available in the configuration list. For the model featuring a fanless NVIDIA T1000 graphics card, please refer to the alternative product listing.

USB 3.2 USB-C Back Panel Option

The back panel supports the optional addition of 2 x USB 3.2 USB-C connectors, which connect to the motherboard. One of the USB-C is 10Gbit/s and the other is 5Gbit/s. Please select these from the options list.

Expertly packed for worldwide shipping. Because the PC is so hefty, 11Kg in weight, we have provided extremely robust packaging. The PC has its own double-walled product box with cushioned interior, and is shipped in a second larger double-walled cardboard box with protective corners. You do not need to worry about the PC arriving in perfect condition!

	Expertly packed for worldwide shipping.  Because the PC is so hefty, 11Kg in weight, we have provided extremely robust packaging.
The PC has its own double-walled product box with cushioned interior, and is shipped in a second larger double-walled cardboard box with protective corners. You do not need to worry about the PC arriving in perfect condition!

Configured to your specification

We can create a solution to meet your specific requirements. Please get in touch with the contact form, online chat, or give us a call.

If you choose the Windows installation option, as well as installing on the internal SSD drive, so it is ready to use out of the box, we also include a USB memory stick with the Windows installation, so you can rebuild or repair Windows if you need to.

You need to supply your own Monitor, Keyboard and Mouse. Please contact us if you need any recommendations or want custom additions bundled with your order.

Contents

✔ Sigao Model B Fanless B860i PC with Intel® Core Ultra 9 285T, DDR5 memory, Samsung 9100 PRO or 990 PRO M.2 PCIe 5.0/4.0 NVMe SSD
✔ 240W 20V Power Adapter brick + Mains Power lead {based on destination country}
✔ BIOS updated to latest version
✔ Memory tested with MemTest86
✔ System soak tested with Passmark BurninTest

Specifications

SSD specifications

The main NVMe M.2 SSD uses the PCIe 5.0 interface to bypass the limitations of the traditional SATA interface.

Samsung 9100 PRO PCIe 5.0 SSD: up to 14,800 MB/s Sequential Read, up to 13,400 MB/s sequential write

Samsung 990 PRO PCIe 4.0 SSD: up to 7,450 MB/s Sequential Read, up to 6,900 MB/s sequential write

Processor specifications

Memory specification

Quality Crucial or Corsair DDR5 memory with heatsink coolers

If the 32GB option is chosen then 2x16GB modules are used.
If the 64GB option is chosen then 2x32GB modules are used.
If the 96GB option is chosen then 2x48GB modules are used.
If the 128GB option is chosen then 2x64GB modules are used.

Motherboard technical specification

See: Motherboard Technical Specification

Fanless heat pipe technology

The CPU and motherboard chipset are cooled using high-performance heat pipes connected to both sides of the case. This passive cooling system efficiently transfers heat to the external cooling fins, delivering a completely silent and highly reliable thermal solution. Thanks to this design, the Core Ultra 9 processor can operate at full load continuously without risk of overheating.

Unlike lower-cost fanless ITX systems that rely on airflow and require case ventilation for chipset cooling, this design uses heat pipe cooling for the chipset as well, ensuring stable performance even under heavy workloads—all without the need for vents or fans.

Case dimensions